During photolithography, it was evenly spread over the surface of the water by spin. Model for spin coating in microelectronic applications r. Analytical solutions of film planarization during spin coating to cite this article. Planarization of deep structures using selfleveling materials. A new plasma etchback planarization technique is presented with countermasking to preplanarize shallow trench isolation sti substrates before chemical mechanical polishing cmp. Spin coating and planarization spin coating and planarization stillwagon, larry e larson, ronald g taylor, gary n. The method was initially known as spinonglass sog and has more recently taken on the more general acronym of spinondielectric sod.
Pdf study of optimization condition for spin coating of the. Spin coating and planarization spie digital library. Polymer properties, such as molecular weight, have significant. Spin coating can be used for the deposition of solgels. Pdf there are four parameters concerning the spin coating of a positive photoresist film. The results of a study of topographic substrate planarization with films applied by a spincoating process are reported. Request pdf modeling the topography of uneven substrates post spincoating the semiconductor.
Planarization of substrate topography by spin coating. A new method to characterize conformality of barc coatings. Modulable nanometerscale surface architecture using spin coating on an adsorbed collagen layer. In this process, solid particles of a polymer compound dissolved in a solvent are spin coated on the substrate surface. Mechanism for the local planarization of microscopically rough surfaces by. Marcia almanzaworkmana, albert jeansb, steve braymenc, richard e. Solvent retention is an important factor for determining the coating profile. We show that spin coating produces conformal film profiles over gaps on the. Planarization of the patterned area was performed with hydrogen silsesquioxane hsq by spin coating. The present invention is a planarization apparatus for planarizing a coating film applied on a substrate before the coating film is hardened, including a contact body such as a brush or sponge brought into. Spin coating is widely used to cast thin films of photoresist, low dielectric constant materials, and polyimide in ic fabrication. Physics and applications of dip coating and spin coating. Spin coating results in a relatively planar surface.
Spin coating and planarization, proceedings of spie 10. Planarization of each layer is essential to achieve multilayer wiring, and application of cmp for global planarization complete planarization from local planarization using sog spinon glass, hitachi. A typical spincoating system for microelectronic wafers is shown in fig. In advanced lithography technology, high planarity soc spinoncarbon materials which can planarize topography substrates are required in order to obtain enough process margin. Planarization process for transparent polyimide coatings. Spin bake cure procedure for spinonglass materials.
Fabrication of nanostructured polymer surfaces using colloidal lithography and spin coating. This study also examines the effects of orientation of the metal structure to polymer flow during spin. The experiments described in this paper were using a spinon material dry film also available. Spincoating is a good method for spreading uniform thin films of polymers that are extremely sticky or.
It is shown that spin coating produces conformal film profiles over topographic gaps on the substrate that are wider than about 50 um and that leveling of these gaps can only occur after spinning ceases if the film is able to. Understanding hsq film properties is key to successful integration of this material into current and future wafer processing lines. A parametric study of spin coating over topography. Benzocyclobutene bcb 402235 polymer thin films by spin. Modeling of spin coating film transfer and hot pressing. Planarization coating for polyimide substrates used in rolltoroll fabrication of active matrix backplanes for flexible displays a. Control ability of spin coating planarization of resist.
Spin coating is a simple method for preparing films from soluble cps prasad et al. Spin oncarbon soc, planarization, photo crosslink, photo curing, uv, reflow, film shrinkage 1. Their predictions agree only qualitatively with the measured film profiles. Fundamental understanding and modeling of spin coating process. Pdf planarization of deep structures using selfleveling. Modeling the topography of uneven substrates post spincoating. Numerical simulations of film planarization, which considered the effects of nonnewtonian fluid behavior, sol. The hsq layer was backetched using rie, resulting in a smooth surface. We show that spin coating produces conformal film profiles over gaps on the substrate with widths greater than about 50 pm and that filling of these gaps can only occur after spinning has ceased provided the film is able to flow over large distances.
Planarization of substrate topography by spin coating iopscience. In the first, or flow, stage of the model, the film profile over a feature is assumed to be controlled by a balance of centrifugal and capillary. Fabrication of nanostructured polymer surfaces using colloidal lithography and spincoating. Soane department of chemical engineering, uniuersity of california, berkeley, berkeley, california 94720 received 14. Planarization of microelectronic structures by using polyimides a b w x l astep achip awafer fig. Understandillg hydrogen silsesquioxanebased dielectric. Introduction recently, very fine patterning with less than hp20nm is created by multiple patterning with arf immersion technology. Siwafers, 150mm diameter, 100oriented were used for. To gain more understanding of the planarization process in.
The twodimensional model can predict film thickness on nonuniform flat substrate. Planarization process for transparent polyimide coatings to reduce topography and overburden variation wusheng shih1, jiro yota2, hoa ly2, ketan itchhaporia1, and alex smith1 1brewer science. Adhesive wafer bonding using photosensitive polymer layers. Kovach, kimberly farnsworth, punit chiniwalla, brian dusch, sue ann bidstrupallen, and paul. Spin coating is a batch process in which a liquid film is spread by centrifugal force. Final thicknesses and refractive indices of bcb films for various coating speeds and. Spinoncarbon soc, planarization, photo crosslink, photo curing, uv, reflow, film shrinkage.
In this process, the cp solution is spread on a rotating substrate. Abstractbenzocyclobutene bcb 402235 polymer thin films were fabricated by spin coating technique in this work. Planarization coating for polyimide substrates used in. Characteristics of diamond turned nip smoothed with ion beam planarization technique yaguo li1,2, hideo takino3 and frank frost1 abstract background. After evaporation of solvent, a thin film is formed. This technique is often used for planarization purposes. Using fill patterns for advanced packaging technologies by. Dielectric spin coating characterization, modeling, and planarization. Dielectric spin coating characterization, modeling, and planarization using fill patterns for advanced packaging technologies by christopher ilic lang s. Planarization process for transparent polyimide coatings to reduce topography and overburden variation wusheng shih1, jiro yota2, hoa ly2, ketan itchhaporia1, and alex smith1 1brewer science, inc. Electron beam enhanced multilayering and planarization in preimidized polyimides rahul manepalli, daniel j. A mathematical model is derived to elucidate the dominant mechanism governing.
Dielectric spin coating characterization, modeling, and. This paper reports the results of a study of topographic substrate planarization with films applied by a spin coating process. A film transfer system suitable for the spin coating film transfer and hotpressing stp method was developed. Model for spin coating in microelectronic applications. Repeating the process is feasible, which can control the thickness of the film. Electron beam enhanced multilayering and planarization in. Solvent concentration measurement for spin coating gu. The process forms a gelatinous network on the substrate. Planarization of patterned magnetic recording media to.
Spin bake cure procedure for spinonglass materials for interlevel and intermetal dielectric planarization effective utilization of honeywell spinon glass materials for the planarization of. Complete analytical solutions of film planarization during spin. It is shown that spin coating produces conformal film profiles over topographic gaps on. Leveling of thin films over uneven substrates during spin. Special spin coating and resist characteristics resist is aliquid chemical at aconstant temperature.
This paper reports the results of a study of topographic substrate planarization with films applied by a spincoating process. Fundamental understanding and modeling of spin coating. Complete analytical solutions of film planarization during. Analytical solutions of film planarization during lateral.
Us4515828a us06222,195 us22219581a us4515828a us 4515828 a us4515828 a us 4515828a us 22219581 a us22219581 a us 22219581a us 4515828 a us4515828 a us 4515828a authority us. All the materials are spinon materials and can be applied with existing spincoating and lithography tool sets. Novel spin on planarization technology by photo curing soc. At high rotation speeds, around to 10 000 rpm, such devices spin lowviscosity liquids to thicknesses from a few microns down to a few nanometers.